Dimethylamine borane (DMAB)

CASRN 74-94-2

Chemical formula: (CH3)2NH·BH3

Mol mass: 58.92

 

Specification

Appearance:  White solid granules

Purity:  98.0 % min

Melting point: 34°C min

 

Additional product form available in late 2011:

DMAB 10% in water solution

 

Packaging

20 kilograms net weight per drum

Sample quantities are available

 

 

 

 

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Lane, C.F. Aldrichim. Acta 1973, 6, 51.

 

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Organic Synthesis

DMAB is a mild reducing agent.  Reactivity with organic functionalities...

 

Physical properties

• White solid granules with strong amine odor
• Flash point: 65°C
• Bulk density: 300-350 g/l
• Solubility in water: 120 g/l at 20°C
• Easily soluble in CH3OH, CH2CL2 & toluene
• Not soluble in hexane or cyclohexane

Environmental, Health & Safety

DMAB is a hazardous material that must be shipped, stored, handled, used, and disposed by qualified individuals according to the law & instructions provided on the MSDS (available from Boron Specialties).  

 

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APPLICATIONS

 

 

+ = reduction      - = no reduction     ~ = other reaction

 

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Printed Circuit Boards

• Post-treatment of surface cupric oxide.  In Akahoshi’s process, DMAB avoids “pink ring” defects in later-stage acid treatments by reducing copper oxide layer to metallic copper, while retaining surface texture for stronger resin bonding.

 

 

Microelectronics

• Oxidation from alkaline solutions for electroless deposition of barrier/capping layers for copper IC interconnect.  Ammonia borane (available in late 2011 from Boron Specialties) has also been demonstrated in this application.

 

 

Electroless Plating

• Low pH alternative for copper metallization of organic and other substrates sensitive to high pH
• Electroless deposition (ED) of PtCl62- using DMAB on a Rh-seeded carbon support for electrochemical and fuel cell applications.
• Deposition of ZnO to yield a transparent conducting oxide